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Apple Inc. has developed a range of "System on Chip" (SoC) as well as "System in Package" (SiP) mobile application processors to power their mobile consumer devices. In order to meet the stringent power and space constraints common to mobile devices, these chips combine a central processing unit (CPU) with other components into a single compact physical package. == Early series == Prior to the introduction of the Apple "A" series of SoCs, Apple used several SoCs in early revisions of the iPhone and iPod Touch. They were specified by Apple and manufactured by Samsung. They integrate a single ARM-based processing core (CPU), a graphics processing unit (GPU), and other electronics necessary to provide mobile computing functions within a single physical package. The APL0098 (also 8900B or S5L8900) is a package on package (PoP) system on a chip (SoC) that was introduced on June 29, 2007 at the launch of the original iPhone. It includes a 412 MHz single-core ARM11 CPU and a PowerVR MBX Lite GPU. It is manufactured by Samsung on a 90 nm process.〔 The APL0278 (also S5L8720) is a package on package (PoP) system on a chip (SoC) that was introduced on September 9, 2008 at the launch of the second generation iPod touch. It includes a 533 MHz single-core ARM11 CPU and a PowerVR MBX Lite GPU. It is manufactured by Samsung on a 65 nm process.〔 The APL0298 (also S5L8920) is a package on package (PoP) system on a chip (SoC) that was introduced on June 8, 2009 at the launch of the iPhone 3GS. It includes a 600 MHz single-core Cortex-A8 CPU and a PowerVR SGX535 GPU. It is manufactured by Samsung on a 65 nm process.〔 A 45 nm die shrunk version of this SoC,〔 the APL2298 (also S5L8922), was introduced on September 9, 2009 at the launch of the third generation iPod touch. 抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』 ■ウィキペディアで「Apple mobile application processors」の詳細全文を読む スポンサード リンク
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